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BGA专用锡膏

BGA专用锡膏

产品参数
成份:SAC305
溶点:217度

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详细介绍


方川介绍彩页1.png





  锡膏
   Solder Paste



方川锡膏是用先进超声波雾化工艺自制的低含氧量真圆焊锡粉沫和基于日本先进焊接技术加以自主研发改良的助焊膏配制而成,

整个生产均为真空或氮气环境中完成的。具有较高的抗耐塌陷性及良好的印刷性等,适合于细间距印刷,且在印刷后,

均可保持长时间的粘著性,针对BGA/QFN/LED有对应的解决方案.

Fangchuan  solder paste is made up of solder powder with low oxygen content,high roundness after

advanced ultrasonic atomizing processes and soldering flux,independently rsearched and improved

process based on the advanced Japanese soldering technology. The entire production is completed

under the vacuum or nitrogen gas environment. It has comparatively high collapse resistance and

good printabilityetc, so it is adaptable to print at fine pitch and can maintain long-term adhesiveness .

锡膏选用指南


A Guide to the Selection of Solder Paste




种 类
Category

特 性 Property

备 注 Remarks

 

 

 

 

BGA系列

印刷寿命特长,残留物为无色透明状,绝缘电阻极高,BGA空洞极低,适合用于航空类,手机产品
The printing life is special service, the residues is colorless and transparent, the dielectric resistance is extremely high. It is suitable for the aviation product.

免清洗

松香类型 :ROL0

 

QFN系列

适合一般表面焊接之印刷及回流使用,无锡球及热塌陷问题出现,完美解决QFN上锡问题. 
It is applicable to the printing and reflow of general surface No side balling and heat collapse, etc. occurrence.

散热器及较难焊接制程使用 
Used for heat radiators and more difficult soldering processes

松香类型 :ROL0

 

FPC系列

印刷寿命特长,针对FPC软板开发,回流后残留物呈透明状。 
Exceptionally long printing service, and the residues after reflow appear to be transparent.

免清洗

松香类型 :ROL0

 

LED BI系列

针对LED开发的低温低银锡膏,解决高成本.

免清洗

松香类型 :ROL0